Description: Encapsulation Resins Market was valued at USD 3.68 Billion in 2019 and is projected to reach USD 4.76 Billion by 2027, growing at a CAGR of 3.3% from 2020 to 2027.
What is Encapsulation Resin?
Encapsulation is a procedure where the electronic components are assembled with resin that aids to protect electronic devices from shock, corrosion, vibration, and moisture. Resin encapsulation aids to protect and insulate printed circuit boards (PCBs) and further electronic devices when exposed to harsh environmental conditions, though forming a fence with the encapsulating resin products. Different encapsulation resins such as epoxy, polyurethane, polyesters, UV curing systems, and silicone are utilized for encapsulation process. For any device encapsulation material should decide on its ability to work under stress, heat and reach a less outgassing performance. Encapsulation resins are mainly used for several applications in electronic and electrical industry.
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Tag: Encapsulation Resins Market